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Cleanroom Waffle Pack Trays for IC Protection

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Cleanroom Waffle Pack Trays for IC Protection

Quality Assurance : Delivery Guarantee, Reliable Quality

Delivery Time : 10 workdays

Reusable : Yes

Certification : ROHS, ISO

Incoterms : EXW, FOB, CIF, DDU, DDP

Capacity : 10x10=100 PCS

Brand Name : Hiner-pack

Payment Terms : T/T

Packing Level : Transport package

Warpage : Warpage MAX 0.25mm

Clean Class : General And Ultrasonic Cleaning

Supply Ability : 2000PCS/Day

Color : Usually black

Ic Type : BGA,QFP,QFN,LGA,PGA

Cavity Size : 2x1.12x0.86 mm

Packaging Details : CARTON, PALLET

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Tray Shape : Rectangular

Place of Origin : China

Model Number : HN24152

MOQ : 1000

Mold Type : Injection

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Cleanroom Waffle Pack Trays for IC Protection

JEDEC standard waffle pack trays adapt to strict semiconductor cleanroom environments. Delivers stable dust isolation and contamination control performance for high-value fragile IC components. Do you need reliable holders to guard fine pitch chips from pollution damage in production?


Features precise closed grid cavity structure. Resists scratch damage and static interference effectively. Maintains stable clean performance through whole chip manufacturing and processing procedures.


Owns stackable durable loading design. Matches packaging, testing, logistics transportation and inventory storage demands perfectly. Preserves intact clean status of sensitive semiconductor chips across entire supply chain links.

Key Features/ Benefits
  • Covers all series waffle pack tray models
  • Effective IC Contamination Control
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Guards ESD-sensitive fine pitch integrated circuits
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24152
Color Usually black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×4 mm
Cavity Size 2x1.12x0.86 mm
Matrix QTY 10x10=100 PCS
Warpage MAX 0.25mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

Cleanroom JEDEC waffle trays serve complete semiconductor industrial chains, covering chip manufacturing, packaging processing, quality inspection, reliability testing, logistics delivery and long-term inventory storage.


Powered by high anti-pollution performance, trays fit QFN/BGA/CSP fine pitch packaging projects. Adapts automated production lines, chip testing operations and daily high-value IC inventory management systems well.

Customized Services
Waffle pack trays support full custom modification on cavity sizes, grid layouts and slot structures. Custom configurations fit various fine pitch IC chip models. Customized cleanroom anti-static materials meet exclusive personalized production handling and storage requirements for all semiconductor scenarios.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

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