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Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips

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Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips

Cavity Size : 1.68x1.55x0.67 mm

Mold Type : Injection

Model Number : HN24177

Price : $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）

Color : Black

Packaging Details : CARTON, PALLET

Clean Class : General And Ultrasonic Cleaning

Packing Level : Transport package

Outline Line Size : 50.7×50.7×7.4 mm

Certification : ROHS, ISO

Warpage : Warpage MAX 0.21mm

Place of Origin : China

Supply Ability : 2000PCS/Day

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Reusable : Yes

Ic Type : BGA,QFP,QFN,LGA,PGA

Tray Shape : Rectangular

Delivery Time : 10 workdays

Payment Terms : T/T

Incoterms : EXW, FOB, CIF, DDU, DDP

Brand Name : Hiner-pack

MOQ : 500 pcs

Capacity : 16x17=272 PCS

Quality Assurance : Delivery Guarantee, Reliable Quality

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Durable High-Temp ESD Waffle Trays for IC Chips

Deliver precise grid structure to hold delicate IC components firmly, preventing shifting and damage during handling. Built with durable material for consistent performance in industrial environments. Offer reliable compatibility with semiconductor production workflows. Seeking high-density trays for secure component storage?


Integrate seamlessly with automated packaging lines and cleanroom workflows. Perform steadily in component loading, transfer, and inventory management procedures. Adapt smoothly to diverse semiconductor manufacturing scenarios.


Support fully customized grid spacing and cavity dimensions to match specific component sizes. Prioritize clean production compatibility. Deliver tailored solutions that optimize packaging efficiency and protect ICs throughout transit.

Key Features/ Benefits
  • Durable construction
  • Precision grid design
  • Suitable for Delicate Fine Pitch ICs
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24177
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×7.4 mm
Cavity Size 1.68x1.55x0.67 mm
Matrix QTY 16x17=272 PCS
Warpage MAX 0.21mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Serve semiconductor IC packaging, cleanroom assembly, component sorting, and high-density storage operations. Compatible with automated handling systems, Class 100/1000 cleanrooms, and high-precision manufacturing lines.


Also utilized in inter-factory component transfer, overseas logistics shipping, and finished component warehousing. Cater to IC manufacturers, packaging houses, and electronic component logistics providers.

Customized Services
Provide fully customized solutions for grid IC waffle trays. Adjust grid spacing, cavity size, and layout to fit diverse component dimensions.

Leverage durable material for enhanced stability. Offer prototype testing and personalized design support to meet unique production and packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Product Tags:

High-Temp Waffle Pack Tray

      

Durable IC Chip Tray

      

Precision Grid Design ESD Tray

      
Quality Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips for sale

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